Speaker

Clark Liu

MJC

Clark Liu, MJC, is speaking at IEEE 35th Asian Test Symposium (ATS 2026) (Kaohsiung, Taiwan, 1–3 Dec 2026) in the session “Keynote: Future New Testing Challenges in Advanced Packaging, Silicon Photonics, and Co-Packaged Optics (CPO) as Multi-Stage Insertion Testing”.

Conferences: 1
Keynotes: 0
Upcoming: 1

Upcoming appearances

IEEE 35th Asian Test Symposium (ATS 2026)
1–3 Dec 2026Kaohsiung, Taiwan
- SpeakerKeynote: Future New Testing Challenges in Advanced Packaging, Silicon Photonics, and Co-Packaged Optics (CPO) as Multi-Stage Insertion Testing

More speakers at IEEE 35th Asian Test Symposium (ATS 2026)

Michael Campbell
Qualcomm Technologies, Inc.
Wu-Tung Cheng
National Tsing Hua University, Taiwan
Adam Cron
Synopsys
Sandeep Kumar Goel
Taiwan Semiconductor Manufacturing Company (TSMC), San Jose, CA
Said Hamdioui
Delft University of Technology (TU Delft, the Netherlands)
Nilanjan Mukherjee
Siemens EDA

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